The part builds upon AMD's previously announced MI300 accelerators introduced late last year, but swaps out its 192 GB of ...

South Korean memory giant SK Hynix has announced it has begun the mass production of the world’s first 12-layer HBM3E, featuring a total memory capacity of 36GB, a huge increase from the ...

Popular Now: CD Projekt CEO dismisses outlandish DEI claims SK hynix is the key to the world of AI chips, with NVIDIA using its HBM3 and HBM3E memory inside of its Hopper H100 and H200 AI GPUs ...

AMD continues to make excellent progress on the hardware and software front for advancing AI. However, AMD’s performance ...

HBM3E is the extended version of HBM3, the fourth generation product that succeeds the previous generations of HBM, HBM2 and HBM2E. The company plans to supply mass-produced products to customers ...

But despite further trade ratio increases on the next-generation HBM4/HBM4E, the rapid ramp of HBM3/HBM3E volumes towards margin accretion builds confidence in Micron's future yield efficiency.

Hearing AMD’s vision and plans, and seeing its entire portfolio, from CPUs, to DPUs and GPUs, paints a compelling strategy ...

HBM3E has a maximum capacity of 36GB per chip over the 24GB cap of HBM3 as well as data transmission rates of 9.6 gigabits per second — meaning, the company said, that a GPU using four 36GB HBM3E ...

SK hynix, the fastest among the three memory companies to mass-produce 12-layer HBM3E products, intends to increase the ...

HBM3E is the extended version of HBM3, the fourth generation product that succeeds the previous generations of HBM, HBM2 and HBM2E. The company plans to supply mass-produced products to customers ...